Planarization for Integrated Circuits

ABSTRACT

A method of planarizing a layer of an integrated circuit. In one embodiment, a liquid film is applied over the layer, using extrusion coating techniques. In another embodiment, the layer itself may be applied as a liquid film, using extrusion techniques.

RELATED APPLICATION

This application is a divisional of application Ser. No. 10/923,435filed Aug. 20, 2004 which is a divisional of application Ser. No.10/195,678, filed Jul. 15, 2002, now U.S. Pat. No. 7,060,633 which is acontinuation-in-part application of application Ser. No. 10/113,008filed Mar. 29, 2002 and entitled, “Via Formation in Integrated CircuitsBy Use of Sacrificial Structures”, now abandoned.

TECHNICAL FIELD OF THE INVENTION

This invention relates to fabrication of integrated circuits, and moreparticularly to a method for planarizing surfaces of integrated circuitlayers.

BACKGROUND OF THE INVENTION

A typical digital integrated circuit comprises a number to transistorsand other electrical elements. The integrated circuit chip is asandwiched structure made up of the silicon substrate, dielectriclayers, metal interconnects, devices and so on. The layers are formed byvarious deposition, photolithographic, and etching techniques.

Advances in integrated circuit capacity and complexity depend onincreases in the density of semiconductor devices and layering of metalcircuitry. Each layer must be planarized prior to the next lithographystep to achieve desired device performance. Deposition means such aschemical vapor deposition or spin coating are conformal, which requiresthem to be subsequently planarized.

To ensure flatness, manufactures typically use chemical mechanicalplanarization (CMP), which is essentially a chemical polishing process.Another approach to planarization is contact planarization, whichinvolves the application of a malleable coating on the surface of achip; the coating then is pressed against an optically clear, flatsurface and cured with ultraviolet light. The coating may be left inplace or removed, leaving the flat substrate.

SUMMARY OF THE INVENTION

One aspect of the invention is a method of planarizing a layer of anintegrated circuit. A liquid film is applied over the layer, usingextrusion coating techniques. In another embodiment, the layer itselfmay be applied as a liquid film, using extrusion coating techniques.

An advantage of the invention is that the extrusion coating is“self-planarizing”. No subsequent planarization steps are needed. As aresult, clean-up steps are eliminated and defects are reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates the formation of pillar-like structures over a metallead of an integrated circuit.

FIG. 2 illustrates the application of an insulating layer over thepillar-like structure.

FIG. 3 illustrates the removal of a portion of the insulating layer toexpose the top of the pillar-like structure.

FIG. 4 illustrates removal of the pillar-like structure.

FIG. 5 illustrates formation of a conductive line.

DETAILED DESCRIPTION OF THE INVENTION

The following description is directed to a method of planarizing one ormore layers of an integrated circuit. For purposes of example, theplanarization is performed for an insulating layer, through which thereis a via. In the example below, the layer in question is applied usingextrusion techniques. In other embodiments, a layer of another materialcould be planarized by applying an extrusion coating on the surface ofthat layer.

“Extrusion” coating is meant here in its conventional sense. Theextruder is mounted above the substrate, and liquid is forced through adie onto the substrate. In the extrusion coating of a hot melt liquid,the liquid is fed into an extruder, and pumped to the substrate.Alternatively, granules of solid form of the liquid are fed into anextruder, where they are melted and homogenized before being pumpedthrough the die. Typically, then, the coating is a hot melt liquidapplied at an elevated temperature. The extruder is motion relative tothe substrate, thinner coatings can be produced where the line speed isfaster than the speed of the extrusion.

FIG. 1 illustrates the formation of a pillar 21 over a metal line 22,which has already been patterned on a semiconductor substrate 23. Pillar21 may be formed from photoresist, using conventional lithographictechniques, including patterning and etching. The material used to formpillar 21 is typically photoresist, but may be any “sacrificial”material, that may subsequently be removed as explained below. Pillar 21need not be column-shaped, but rather may be any structure having ashape such that when sacrificially removed, will form a via.

FIG. 2 illustrates the application of an insulating layer 31. Asillustrated, insulating layer 31 encapsulates pillar 21. Insulatinglayer 31 may be any material suitable for an interlevel dielectric layerof an integrated circuit.

Extrusion coating is especially described for applying layer 31 becauseof its ability to provide a planarized surface. In contrast, otherdeposition methods, such as chemical vapor deposition or spin coating,are conformal and require an etch back or chemical mechanicalplanarization to achieve a desired planar surface.

For extrusion coating, the desired material may be applied in the formof a solution gel or liquid film. For liquid films applied by extrusioncoating, application of the film may be followed by other processing,such as thermal or photochemical steps, in which the uniformity achievedthrough deposition is maintained. During these subsequent process steps,the chemical or physical structures of the film or underlying layers orinterfaces may change, that is, these steps have a curing effect.

Experimental testing with extrusion coating has indicated that surfacefeatures may be coated and planarized to less than 250 angstroms. Thesame features covered by a spin coating typically result innonplanarities of approximately 1800 angstroms.

FIG. 3 illustrates an etch back of insulating layer 31 to expose pillar21. The etch may be either a wet or dry etch, such as a wet chemical ordry plasma etch. The etching is performed for a duration sufficient toexpose at least the top surface of pillar 21.

FIG. 4 illustrates the removal of pillar 21. This may be achieved with arelatively gentle etch, such as gentle plasma etch. This type of plasmaetch is commonly called an ash process, but other selective isotropicetches may be used, if suitable for removing the material from whichpillar 21 is made may be used. The avoidance of anisotropic etchingeliminates etch residue issues. After the sacrificial structure, thatis, pillar 21, has been removed, a via 51 is formed in layer 31 andextends to metal line 22. As shown in FIG. 5, a conductive line 61 canbe formed over via 51 and layer 31.

OTHER EMBODIMENTS

Although the present invention has been described in detail, it shouldbe understood that various changes, substitutions, and alterations canbe made hereto without departing from the spirit and scope of theinvention as defined by the appended claims.

1. A method of providing a planarized layer of an integrated circuit,comprising: depositing a layer as a liquid film by means of extrusion;forming a recess in the layer; and forming a conductor within the recessin the layer.
 2. The method of claim 1 and further comprising curing theliquid film by performing a thermal step.
 3. The method of claim 1 andfurther comprising curing the liquid by performing a photochemical step.4. The method of claim 1 wherein the substantially planar surface isplanarized to less than 250 angstroms.
 5. The method of claim 1 whereinforming a recess in the layer comprises removing a sacrificial material.